Partnership between PHYTEC and Texas Instruments began in 1995 with the design of miniMODUL-DSPC5x, which was equipped with a TMS320C5x Digital Signal Processor (DSP). PHYTEC has continued to design System on Modules (SOMs) based on TI chips including DM387x, DM814x, OMAP3, OMAP4, AM57x and now the newer AM6 series of Applications Processors including most recently the AM67x, AM62P and AM62L, powering industrial, vision, and edge applications worldwide and across industries and applications. This sustained collaboration has given PHYTEC engineers deep familiarity with TI's processor roadmap, translating directly into faster design cycles, more robust reference circuitry, and better-supported products for end customers.
At embedded world 2026, TI highlighted its evolved Partner Program and named PHYTEC a Premium Partner, the highest tier of the program. This recognition reflects the tangible outcomes of that collaboration — from simplified embedded designs and faster customer time-to-market, to a broad, well-supported SOM portfolio that gives industrial developers real scalability and flexibility.
Roland Sperlich, Processors Business Unit Manager at Texas Instruments, handing the Premium partner award to Bodo Huber, Managing Director & CTO at PHYTEC. Source / Copyright: PHYTEC
Also at embedded world, PHYTEC launched new System on Modules based on the AM62P processor. The phyCORE-AM62P is part of PHYTEC’s core product line of connectorized SOMs which can be fully customized and bring out every signal from the processor to the connectors. The phyFLEX-AM62P is part of PHYTEC’s phyFLEX line of interchangeable solder-down SOMs, enabling future-proof designs and scalability. It complements PHYTEC’s broad portfolio of SOMs with TI processors including AM62x, AM62A, AM62L, AM64x, AM65x, AM67x, and AM68A. All products receive twice a year Software BSP updates as well as U-Boot and Linux upstream support.
PHYTEC is committed to its long-term relationship and broad coverage of TI processors. PHYTEC’s product design and reference circuitry pair up with additional TI components including MCUs, DSPs, PMICs, Ethernet PHYs, converters, and top-tier analog power components to enable customers to get to production faster with the latest technology.
Bodo Huber, Managing Director & CTO at PHYTEC, says:
“Our close collaboration with TI helps us provide our customers with a comprehensive portfolio of embedded modules, design services, and development support, enabling them to bring their products to market faster. TI’s processor line-up offers developers scalable options and a maximum level of flexibility for diverse industrial requirements. As part of the newly defined Partner Program—and especially through our designation as a Premium Partner—new possibilities are opening up for us. We are looking forward to the next chapter in the success story of TI and PHYTEC.”
Roland Sperlich, Processors Business Unit Manager at Texas Instruments, adds:
“PHYTEC exemplifies the kind of dedicated partner that helps translate TI's processor technology into real-world customer value. Their deep expertise in embedded module design and commitment to supporting customers from concept to production makes them a valued Premium Partner. We share a vision of giving industrial developers the scalability and flexibility they need to tackle the most demanding applications. We are proud to deepen this relationship and look forward to co-creating the next generation of industrial solutions together.”
Three decades of collaboration culminate in PHYTEC's designation as TI Premium Partner.
Source / Copyright: PHYTEC